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United States of America Patent
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N/A
Issued Date -
Jun 9, 2011
app pub date -
Dec 1, 2010
filing date -
Dec 4, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An electronic component package including an electronic component having a circuit surface, a block of resin partially surrounding the electronic component, and a multi-layer interconnection in contact with said circuit surface, wherein the multi-layer interconnection is connected to bond-pads having a pitch lower than 50 μm, and the block of resin is made of injection-molding resin.
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