WAFER LEVEL OPTICAL IMAGING APPARATUS

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United States of America Patent

APP PUB NO 20110133301A1
SERIAL NO

12630776

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Abstract

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A wafer level optical imaging apparatus includes a covering substrate that covers an imaging unit. A top shading layer is formed on a top surface of the covering substrate, and a bottom shading layer is formed on a bottom surface of the covering substrate.

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Patent Owner(s)

Patent OwnerAddress
WISEPAL TECHNOLOGIES INCNO 26 ZIH LIAN ROAD FONGHUA VILLAGE SINSHIH TOWNSHIP TAINAN COUNTY 74445

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
TANG, NAI-YUAN TAINAN, TW 189 2646

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