COOLING METHOD AND COOLING SYSTEM OF ELECTRONIC DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20110127027A1
SERIAL NO

12957628

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A cooling method of an electronic device, the cooling method naturally circulating a cooling medium between an evaporator, which gasifies the cooling medium and cools heat-discharging air from the electronic device by heat exchange with the heat-discharging air, and a cooling tower or a condenser, which is disposed at a higher position than the evaporator and liquefies the gasified cooling medium, and subjecting a flow rate of the cooling-medium liquid supplied to the evaporator to valve control so that a temperature of the air obtained after the heat exchange and the cooling by the evaporator becomes a temperature suitable for an operating environment of the electronic device, wherein the improvement comprises that a condensation temperature or a condensation pressure of the cooling-medium gas in the cooling tower or the condenser is configured to be not varied even when the flow rate of the cooling-medium liquid supplied to the evaporator is subjected to the valve control.

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Patent Owner(s)

Patent OwnerAddress
HITACHI PLANT TECHNOLOGIES LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inadomi, Yasuhiko Tokyo, JP 10 90
Ito, Junichi Tokyo, JP 211 3416
KASHIRAJIMA, Yasuhiro Tokyo, JP 17 305
Oshima, Noboru Tokyo, JP 51 848
Senda, Masakatsu Tokyo, JP 12 129
Shimokawa, Ryoji Tokyo, JP 5 72
Sugiura, Takumi Tokyo, JP 35 435

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