LIGHT EMITTING MODULE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
May 26, 2011
app pub date -
Aug 28, 2008
filing date -
Aug 31, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided are a light emitting module and a manufacturing method thereof, the light emitting module having improved heat radiation properties and improved adhesion between a sealing resin for sealing a light emitting element and other members. A light emitting module 10 includes: a metal substrate 12; a concave part 18 provided by partially denting an upper surface of the metal substrate 12; a light emitting element 20 accommodated in the concave part 18; and a sealing resin 32 covering the light emitting element 20. A convex part 11 is further provided on the upper surface of the metal substrate 40 in a region thereof surrounding the concave part 18. The sealing resin 32 is allowed to adhere to the convex part 11, thereby improving adhesion strength between the sealing resin 32 and the metal substrate 12.
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