CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND JOINT BOX USING CIRCUIT BOARD

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United States of America Patent

SERIAL NO

13006122

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A circuit board includes a foil circuit provided on a synthetic resin plate formed by injection molding, made of a copper foil, and having a pattern different for the circuit board. Anchor pins projecting upward are provided on the resin plate and passed through pinholes made in the foil circuit. The foil circuit is positioned and secured to the resin plate. In a required portion of the resin plate, a terminal insertion hole is provided, and a receiving terminal is secured to the required portion of the terminal insertion hole and connected to the foil circuit.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI CABLE INDUSTRIES LTD4-1 MARUNOUCHI 3-CHOME CHIYODA-KU TOKYO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AMBO, Tsugio Tokyo, JP 21 185
Fujiwara, Satoru Tokyo, JP 32 393
Hasegawa, Yoshikatsu Tokyo, JP 8 85
Kashioka, Tooru Tokyo, JP 3 14
Nakagawa, Chihiro Tokyo, JP 9 360
Ono, Takeshi Tokyo, JP 206 2498
Shimazawa, Katsuji Tokyo, JP 8 88
Urushidani, Atsushi Tokyo, JP 3 14

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