DEVICE FOR THE THERMAL TREATMENT OF WORKPIECES
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United States of America Patent
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Issued Date -
May 19, 2011
app pub date -
May 18, 2009
filing date -
Jul 15, 2008
priority date (Note) -
Abandoned
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Abstract
The invention relates to a device for the thermal treatment of workpieces, in particular printed circuit boards or the like equipped with electrical and electronic components, said device comprising a process chamber (1) in which there is formed or arranged at least one heating zone or cooling zone which has a heating device or a cooling device and through which the workpieces are transported along a transporting section while being heated or cooled, wherein a pressurized gaseous fluid can be introduced into the heating zone or the cooling zone via inflow openings (18).
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