CURABLE COPOLYMER AND CURABLE RESIN COMPOSITION

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United States of America Patent

APP PUB NO 20110112266A1
SERIAL NO

13001439

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Abstract

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represents a single bond or, e.g., an alkylene group having 1 to 18 carbon atoms). The copolymer, when used as a radiation-sensitive resin, can give a high-performance cured film excellent in hardness, solvent resistance, and thermal stability.

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Patent Owner(s)

Patent OwnerAddress
DAICEL CHEMICAL INDUSTRIES LTD1-BANCHI TEPPO-CHO SAKAI-SHI OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nijukken, Toshihiko Hyogo, JP 6 10
Takawaki, Koichi Hyogo, JP 3 4

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