INTEGRALLY INJECTION-MOLDED ALUMINUM/RESIN ARTICLE AND PROCESS FOR PRODUCING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 12, 2011
app pub date -
Jun 11, 2009
filing date -
Jun 12, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided are an integrally injection-molded aluminum/resin article capable of having extremely high adhesion strength and air tightness at the interface between an aluminum shape made of an aluminum alloy and a molded resin integrally bonded to each other by injection molding, retaining excellent adhesion strength and air tightness in harsh environments in terms of temperature, humidity, dust, and the like, and exhibiting excellent durability and heat resistance, and a process for producing the same. The integrally injection-molded aluminum/resin article includes: an aluminum shape which is made of an aluminum alloy and has recesses derived from irregularities formed in the surface; and a molded resin which is integrally formed on the surface of the aluminum shape by the inject ion molding of a thermoplastic resin and has fitting portions formed in the recesses by the entering of the thermoplastic resin followed by solidification during the injection molding, the aluminum shape and the molded resin being locked with each other through the recesses and the fitting portions.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
NIPPON LIGHT METAL COMPANY LTD | TOKYO 105-0004 | |
POLYPLASTICS CO LTD | TOKYO 108-8280 |
International Classification(s)

- 2009 Application Filing Year
- C23F Class
- 429 Applications Filed
- 202 Patents Issued To-Date
- 47.09 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Endo, Masanori | Shizuoka, JP | 46 | 417 |
# of filed Patents : 46 Total Citations : 417 | |||
Miyamoto, Yasumitsu | Shizuoka, JP | 8 | 55 |
# of filed Patents : 8 Total Citations : 55 | |||
Nagasawa, Daisuke | Shizuoka, JP | 8 | 22 |
# of filed Patents : 8 Total Citations : 22 |
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Patent Citation Ranking
- 13 Citation Count
- C23F Class
- 62.77 % this patent is cited more than
- 14 Age
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- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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