Process For Producing Ultra-Thin Biscuits With A Smooth Surface
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United States of America Patent
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Issued Date -
May 12, 2011
app pub date -
Jun 25, 2008
filing date -
Mar 31, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to a process for making a thin biscuit having a smooth surface, including mixing ingredients at a temperature between 37° C. and 70° C. to obtain a sheetable cohesive dough. The dough includes 0-56% wheat flour, 4-62% native starch, and 1-26% pre-gelatinised starch. For one unit of weight of native starch NS, pre-gelatinised starch PS, and wheat flour WF, i.e. with NS+PS+WF=1, WF≦0.8, PS≦0.37 and 0.7≦NS/PS≦9. The dough also includes 5-18% water, 2-12% fat, 0-28% sugar; 0-8% whey powder, and 0%-0.5% salt, but devoid of a leavening agent. The process also includes sheeting the dough to a thickness between 0.2 and 1 mm; cutting the sheeted dough into dough pieces; and baking the dough pieces on a perforated support to obtain a thin biscuit that is devoid of blisters.
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