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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
WORDLOCK INC	SANTA CLARA CA

International Classification(s)

• B23P:OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVE....
• E05B:LOCKS; ACCESSORIES THEREFOR; HANDCUFFS

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Basche, Todd	Los Altos, US	17	180
# of filed Patents : 17 Total Citations : 180

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Patent Citation Ranking

• 1 Citation Count
• B23P Class

• 10.34 % this patent is cited more than
• 14 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2014/0292,415

SEMICONDUCTOR DEVICE HEAT DISSIPATION USING HIGH THERMAL CONDUCTIVITY DIELECTRIC LAYER

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Abstract

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Semiconductor devices are disclosed including a bulk substrate, an epitaxial collector layer, an epitaxial base layer, an epitaxial emitter layer and an electrical insulator layer in direct thermal contact with at least a portion of the base layer, emitter layer, and/or collector layer. At least a portion of the electrical insulator layer has high thermal conductivity properties, which can provide for dissipation of undesirable thermal energy through the electrical insulator layer.

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Description

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