HIGH-DENSITY SPLITTER/PATCH TELECOMMUNICATIONS SYSTEM
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United States of America Patent
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Issued Date -
May 5, 2011
app pub date -
Oct 30, 2009
filing date -
Oct 30, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A high-density telecommunications patch/splitter system to allow a user to access multiple adapters disposed on even high-density splitter modules and odd high-density splitter modules. The even high-density splitter modules have an even adapter array and the odd high-density splitter modules have an odd adapter array that, when installed in the chassis, allow a user access to the adapters.
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