Metal-passivating CMP compositions and methods
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United States of America Patent
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May 7, 2013
Grant Date -
May 5, 2011
app pub date -
Jan 11, 2011
filing date -
Nov 27, 2007
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Abstract
The present invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing copper- and/or silver-containing substrates. The compositions of the present invention comprise a particulate abrasive, a primary film-forming metal-complexing agent, and a secondary film-forming metal-passivating agent in an aqueous carrier. Methods of polishing a substrate with the compositions of the invention are also disclosed.
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