MULTI-LAYER STRUCTURE INCLUDING A BUFFER LAYER
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United States of America Patent
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Issued Date -
Apr 28, 2011
app pub date -
Sep 17, 2010
filing date -
Oct 23, 2009
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Abandoned
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Abstract
A multi-layer structure including a buffer layer is to couple with a substrate in a die. The multi-layer structure includes a biological material layer, a bonding layer and a thermoplastic buffer layer. The biological material layer has a first surface attached to the bonding layer. The buffer layer has one side boned with the bonding layer. The buffer layer has a compressed surface to withstand high pressure and be bonded to the substrate. The bonding layer and buffer layer are made of thermoplastic material, and are bonded together firmly through thermal fusion. The compressed surface of the buffer layer directly withstands the injection temperature and pressure exerting to the substrate in the mold, therefore can alleviate the temperature and pressure withstood by the biological material layer. Hence the biological material layer is protected without being damaged in the mold, and bonding between the multi-layer structure and substrate has longer lifespan.
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