PRINTED CIRCUIT BOARD WITH INSULATING AREAS
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United States of America Patent
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N/A
Issued Date -
Apr 28, 2011
app pub date -
Dec 30, 2009
filing date -
Oct 28, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A printed circuit board includes a substrate including a first surface and a second surface opposite to the first surface, a pair of first pads positioned on the first surface and the second surface, and a plurality of insulating areas. The substrate defines a through hole and a plurality of vias extending from the first surface to the second surface. Each of the pair of first pads surrounds the through hole. The insulating areas are adjacent to the first pad to divide a reference metal layer of the substrate adjacent to the first pads into a plurality of metal strips to reduce heat dissipation area of the reference metal layer adjacent to the first pads. The vias are adjacent to the metal strips to supply extra heat to molten solder on the first surface in a wave-soldering process.
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