METHOD FOR CLUING FLEXIBLE CIRCUIT BOARDS TO POLYMER MATERIALS FOR PARTIAL OR COMPLETE STIFFENING
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United States of America Patent
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Issued Date -
Apr 28, 2011
app pub date -
Jan 21, 2009
filing date -
Jan 28, 2008
priority date (Note) -
Abandoned
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Abstract
A method for producing circuit boards, comprising a process for modifying a flexible circuit board, in particular for the stabilization thereof, characterized by at least the following method steps: a) providing a planar formation (“reinforcement plate”) having lower flexibility than that of the flexible circuit board, b) hot laminating an adhesive film, which can be activated by heat, on the reinforcement plate, c) placing the laminate made of adhesive film and reinforcement plate with the adhesive film side on the flexible circuit board, d) introducing the component made of reinforcement plate, adhesive film, and flexible circuit board into a partial vacuum atmosphere, e) hot laminating the component with application of pressure and heat.
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