MICROELECTRONIC PROCESSING COMPONENT HAVING A CORROSION-RESISTANT LAYER, MICROELECTRONIC WORKPIECE PROCESSING APPARATUS INCORPORATING SAME, AND METHOD OF FORMING AN ARTICLE HAVING THE CORROSION-RESISTANT LAYER
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United States of America Patent
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Issued Date -
Apr 21, 2011
app pub date -
Oct 19, 2010
filing date -
Oct 20, 2009
priority date (Note) -
Abandoned
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Abstract
A microelectronic processing component can include a substrate and a corrosion-resistant layer. The substrate can include a metal-containing material, and the corrosion-resistant layer can be adjacent to the surface region. The corrosion-resistant layer can include a first portion and a second portion each including a rare earth compound, wherein the first portion is disposed between the substrate and the second portion, and the first portion has a first porosity, and the second portion has a second porosity that is greater than the first porosity. The component can be component within a processing apparatus used to process microelectronic workpieces. In a particular embodiment, the component can be exposed to the processing conditions as seen by the microelectronic workpiece when fabrication a microelectronic device from the microelectronic workpiece. Methods can be used to achieve the difference in porosity, and such methods can be for articles other than microelectronic processing components.
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