Multi-Layer Connection Cell
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United States of America Patent
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Issued Date -
Apr 21, 2011
app pub date -
Oct 20, 2009
filing date -
Oct 20, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor multi-layer connection cell is disclosed that includes configuration layers and “via” layers disposed between the configuration layers to allow configuration of signals at any layer in the connection cell. The layers include column structures extending through the layers. Each column structure includes a hole in a layer that can be filled to form an electrical connection between layers.
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