SYSTEMS AND PROCESSES FOR FORMING THREE-DIMENSIONAL CIRCUITS

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United States of America Patent

SERIAL NO

12975267

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Abstract

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Provided are systems and processes for forming a three-dimensional circuit on a substrate. A radiation source produces a beam that is directed at a substrate having an isolating layer interposed between circuit layers. The circuit layers communicate with reach other via a seed region exhibiting a crystalline surface. At least one circuit layer has an initial microstructure that exhibits electronic properties unsuitable for forming circuit features therein. After being controllably heat treated, the initial microstructure of the circuit layer having unsuitable properties is transformed into one that exhibits electronic properties suitable for forming circuit feature therein. Also provided are three-dimensional circuit structures optionally formed by the inventive systems and/or processes.

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Patent Owner(s)

Patent OwnerAddress
ULTRATECH INC3050 ZANKER ROAD SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hawryluk, Andrew M Los Altos, US 82 2909
Wang, Yun San Jose, US 472 7076
Zafiropoulo, Arthur W Atherton, US 29 1521

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