MULTICHIP TYPE LED PACKAGE STRUCTURE FOR GENERATING LIGHT-EMITTING EFFECT SIMILAR TO CIRCLE SHAPE
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United States of America Patent
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Issued Date -
Apr 21, 2011
app pub date -
Jan 14, 2010
filing date -
Oct 19, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A multichip type LED package structure for generating light-emitting effect similar to circle shape includes a substrate unit, a light-emitting unit and a package unit. The substrate unit has a substrate body and a plurality of conductive circuits separated from each other by a predetermined distance and disposed on the substrate body. Each conductive circuit has a plurality of extending portions, and the extending portions of every two conductive circuits are adjacent to each other and are alternated with each other. The light-emitting unit has a plurality of LED chips selectively electrically disposed on the substrate unit. The package unit has a light-transmitting package resin body formed on the substrate unit to cover the LED chips.
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