OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Apr 21, 2011
app pub date -
Oct 19, 2009
filing date -
Oct 19, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Provided is a method of providing an opto-electrical assembly. The method comprises attaching a second electrical element to a carrier using a second attachment region at a second attaching temperature. The second attaching temperature is associated with the melting temperature of the second attachment region, such as the melting temperature of solder or the like. The carrier already comprises a first opto-electrical element having been attached to the carrier using a first attachment region at a first attaching temperature, whereby the first attaching temperature is associated with the melting temperature of the first attachment region. The method is provided such that the second attachment region has a lower melting temperature than the first attachment region such that the second attaching temperature is lower than the first attaching temperature. The resulting opto-electrical carrier assembly is compatible to industry-standard RoHS-compliant solder reflow attachment schemes to PCB and ceramic substrates (and similar).
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully