BONDING APPARATUS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Apr 14, 2011
app pub date -
Feb 19, 2009
filing date -
Feb 20, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Bonding apparatus (10) for bonding a thermoplastic first material (12) to a second material (14) includes a heater arrangement (22) for heating a bonding surface (16) of the first material (12) to melt the bonding surface (16), and moving means (30) for moving the first and second materials (12, 14) together to a bonded condition.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully