ELECTRODE FORMING METHOD

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United States of America Patent

SERIAL NO

12975873

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Abstract

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The present invention provides an electrode forming method in which an electrode layer is formed on a solid electrolyte, capable of obtaining an electrode layer having a large electrode surface area, decreasing the number of steps required in formation of the electrode layer and reducing a human labor and time. The electrode forming method of the invention is an electrode forming method, in which a metal salt solution and a reducing agent solution are disposed on respective both sides of a solid electrolyte form and the metal salt solution is caused to pass through the solid electrolyte form by osmosis to thereby deposit a metal near the interface on the reducing agent solution side of the solid electrolyte form to thereby form the electrode on the solid electrolyte form.

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Patent Owner(s)

Patent OwnerAddress
EAMEX CORPORATION9-30 TARUMI-CHO 3-CHOME SUITA 564-0062

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Onishi, Kazuo Osaka, JP 31 307
Sewa, Shingo Osaka, JP 13 211

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