THERMOSETTING EPOXY COMPOSITION WITH LOW EXPANSIBILITY
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United States of America Patent
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Issued Date -
Apr 7, 2011
app pub date -
Sep 29, 2010
filing date -
Oct 2, 2009
priority date (Note) -
Abandoned
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Abstract
A thermosetting epoxy composition contains a modified silicon dioxide and is suitable for use in preparing an epoxy laminate having a low coefficient of thermal expansion and good drilling workability, which modified silicon dioxide contains no crystal water, has low expansibility, and contains 40% to 80% by weight of silicon dioxide and 60% to 20% by weight of an inorganic additive, and the modified silicon dioxide is obtained by a high-temperature (above 1000° C.) sintering process followed by a crushing process.
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