HIGHLY ELECTRICALLY CONDUCTIVE SURFACES FOR ELECTROCHEMICAL APPLICATIONS AND METHODS TO PRODUCE SAME
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United States of America Patent
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N/A
Issued Date -
Mar 31, 2011
app pub date -
Sep 28, 2010
filing date -
Sep 28, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method to use a novel structured metal-ceramic composite powder to improve the surface electrical conductivity of corrosion resistant metal substrates by thermal spraying the structured powder onto a surface of a metallic substrate is disclosed. The structured powder has a metal core and is wholly or partially surrounded by an electrically conductive ceramic material such as a metal nitride material. The metal cores may have the ceramic material formed on them prior to a thermal spraying process performed in an inert atmosphere, or the thermal spraying may be performed in a reactive atmosphere such that the ceramic coating forms on the cores during the thermal spraying process and/or after deposition. The metal cores will bond conductive ceramic material onto the surface of the substrate through the thermal spray process.
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Patent Citation Ranking
- 34 Citation Count
- C23C Class
- 84.38 % this patent is cited more than
- 14 Age