Methods for Patterning Substrates Using Heterogeneous Stamps and Stencils and Methods of Making the Stamps and Stencils
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United States of America Patent
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Issued Date -
Mar 31, 2011
app pub date -
Aug 20, 2010
filing date -
Aug 21, 2009
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Abandoned
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Abstract
The present invention is directed to heterogeneous stamp and stencil compositions, methods for patterning substrates using contact printing processes employing the heterogeneous stamps and stencils, and products formed by the contact printing processes.
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