MEMS MICROPHONE PACKAGE
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United States of America Patent
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Issued Date -
Mar 31, 2011
app pub date -
Jan 27, 2010
filing date -
Sep 28, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A MEMS microphone package is disclosed. The MEMS microphone package comprises a housing, a MEMS die and an ASIC chip. The housing includes a base, a sidewall extending from the base, and a cover supported by the sidewall for forming a receiving space. The housing defines an acoustic hole for receiving external sound waves. The MEMS die is accommodated in the housing and the MEMS die defines a plurality of first conductive pads. The ASIC chip is accommodated in the housing and the ASIC chip defines a plurality of second conductive pads.
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