THERMALLY CONDUCTIVE POLYMER COMPOSITIONS
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United States of America Patent
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Issued Date -
Mar 31, 2011
app pub date -
Sep 30, 2010
filing date -
Sep 30, 2009
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Abstract
A thermally conductive polymer composition, comprising a polymer, conductive charges in an amount of about 35% by weight or less, and a compatibilizer, the composition having a transverse thermal conductivity of about 0.5 W/m/K or more and a deformation at break of about 850% or less The composition is fabricated by i) feeding a polymer and a compatibilizer in a feed zone of an extruder to obtain a melted resin; ii) introducing directly into the extruder downstream of the feed zone, conductive charges in an amount of about 35% by weight or less into the melted resin; and iii) providing a degassing zone before the output of the thermally conductive polymer composition produced.
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