PAIRED LOW-CHARACTERISTIC IMPEDANCE POWER LINE AND GROUND LINE STRUCTURE
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United States of America Patent
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Issued Date -
Mar 31, 2011
app pub date -
May 21, 2009
filing date -
May 22, 2008
priority date (Note) -
Abandoned
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Abstract
Disclosed is a paired low-characteristic impedance power line and ground line structure in which loop inductance is substantially 0. The paired low-characteristic impedance power line and ground line structure includes a laminated sheet in which a metal wiring layer having a power line and a ground line is provided on the surface of an insulating sheet, an insulating thin-film layer provided so as to cover the power line and the ground line, and a resistive layer provided on the surface of the insulating thin-film layer.
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