METHOD FOR MANUFACTURING POLISHING HEAD AND POLISHING APPARATUS
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United States of America Patent
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Issued Date -
Mar 24, 2011
app pub date -
Jun 2, 2009
filing date -
Jun 24, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for manufacturing a polishing head having an annular rigid ring; a rubber film bonded to the rigid ring with uniform tension; a mid plate joined to the rigid ring, forming a space together with the rubber film and the rigid ring; and a mechanism for changing pressure of the space, the method including performing a tensile test on the rubber film according to JIS K6251 before bonding the rubber film to the rigid ring, and selecting the rubber film having a value of 10 MPa or less of an inclination obtained by a linear approximation of a stress-strain curve within a strain value of 5%; and bonding the selected rubber film having a value of 10 MPa or less of the inclination to the rigid ring to manufacture the polishing head.

First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SHIN-ETSU HANDOTAI CO LTD | 2-1 OHTEMACHI 2-CHOME CHIYODA-KU TOKYO 1000004 | |
FUJIKOSHI MACHINERY CORP | 1650 KIYONO MATSUSHIRO-MACHI NAGANO-SHI NAGANO 381-1233 |
International Classification(s)

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Arakawa, Satoru | Nagano, JP | 11 | 56 |
Hashimoto, Hiromasa | Nishishirakawa, JP | 64 | 984 |
Kishida, Hiromi | Nagano, JP | 11 | 28 |
Masumura, Hisashi | Nishishirakawa, JP | 44 | 582 |
Morita, Kouji | Nishishirakawa, JP | 40 | 262 |
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Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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