Heat Dissipation Module For Bulb Type LED Lamp
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United States of America Patent
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Issued Date -
Mar 24, 2011
app pub date -
Sep 21, 2009
filing date -
Sep 21, 2009
priority date (Note) -
Abandoned
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Abstract
The heat dissipation module includes a heat dissipation assembly and a heat conducting element. The heat dissipation assembly includes a cylinder provided with a central hole. The central hole tapers off inwards to form two corresponding inclined surfaces. The heat conducting element, which is accommodated in the central hole, has a heat-absorbing section and two heat-releasing sections extending from the heat-absorbing section and being in contact with the inclined surfaces.
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