COMPOSITIONS WITH IMPROVED SEALING CHARACTERISTICS FOR MOLD-IN-PLACE GASKETS

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United States of America Patent

SERIAL NO

12953723

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Abstract

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The present invention relates to compositions with improved sealing characteristics for mold-in-place gaskets, and a process for forming a mold-in-place gasket by liquid injection molding. More particularly, the present invention relates to a mold-in-place gasket composition incorporating (meth)acrylate-functionalized silica, plasticizers, or both, with improved modulus and sealing properties, and a process for forming such mold-in-place gasket.

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Patent Owner(s)

Patent OwnerAddress
HENKEL CORPORATIONAMBLER PA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DeCato, Alfred A Waterbury, US 22 142
Lionberger, James E East Hampton, US 7 37

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