Curing Pin Material Optimization
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United States of America Patent
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Issued Date -
Mar 17, 2011
app pub date -
May 22, 2008
filing date -
May 22, 2008
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Abandoned
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Abstract
A method to cure a non-uniform rubber article uses one or more high thermal diffusivity pins in a mold to direct heat to the cure-limiting parts of the article to reduce the total cure time in the mold and increase the uniformity of the cure of the article. Reductions in cure time of up to 20% or more are achieved without substantially changing the function or degrading the performance of the article. The method is particularly useful for curing tires and treads for tires. Finite element analysis or thermocouple probes can used to determine the cure-limiting part(s) for the tire or tread. Using this knowledge, one or more of the high thermal diffusivity pins are located in the mold at positions to transfer heat into the cure-limiting part(s).
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