Wired-circuit-board assembly sheet and producing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20110061900A1
SERIAL NO

12923159

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Abstract

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A wired-circuit-board-assembly sheet includes a plurality of wired circuit boards arranged in parallel in one direction, which are regularly omitted at given intervals, and a plurality of units defined by margin portions where the wired circuit boards are omitted.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATION1-1-2 SHIMOHOZUMI IBARAKI-SHI OSAKA 567-8680

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kondou, Yoshihiko Osaka, JP 11 102
Tanabe, Hiroyuki Osaka, JP 84 509
Umetani, Shigehiro Osaka, JP 3 4

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