DEVICE FOR COOLING SEMI-CONDUCTORS
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United States of America Patent
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Issued Date -
Mar 17, 2011
app pub date -
Sep 16, 2010
filing date -
Sep 16, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The device serves for cooling electronic structural elements and has a cooling body and a metal base plate constructed as a part of the support of the structural element. The cooling body is arranged adjacent the base plate. A connecting element is arranged at least over areas between the base plate and the cooling body. The connecting element is at least partially constructed of a metal which has a melting temperature of at least 60° C. The connecting element is provided with a frame-like seal.
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