CMOS IMAGE SENSOR HAVING A CURVED SEMICONDUCTOR CHIP
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United States of America Patent
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Issued Date -
Mar 10, 2011
app pub date -
Sep 3, 2010
filing date -
Sep 7, 2009
priority date (Note) -
Abandoned
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Abstract
A digital image sensor includes a planar substrate with one or more bonding pads on one side and a silicon chip with one or more bonding pads. The silicon chip is attached on the planar substrate through the one or more bonding pads. The attachment of the silicon chip to the planar substrate is performed in a manner such that the silicon chip, when attached, has a curved shape.
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