ELECTROLYTIC PLATING EQUIPMENT AND ELECTROLYTIC PLATING METHOD
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United States of America Patent
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Issued Date -
Mar 10, 2011
app pub date -
Sep 7, 2010
filing date -
Sep 8, 2009
priority date (Note) -
Abandoned
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Abstract
An electrolytic plating equipment includes: a plating tank for holding plating solution; and a separate tank apart from the plating tank, for holding the plating solution circulating between the plating tank and the separate tank. The separate tank contains a first space and a second space located downstream from the first space. The plating solution in the first space in an amount exceeding a specific height flows from the first space into the second space, and the plating solution falls through air in the second space.
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