PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Mar 10, 2011
app pub date -
Sep 4, 2009
filing date -
Sep 4, 2009
priority date (Note) -
Abandoned
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Abstract
A package substrate and a manufacturing method thereof are provided, including: forming a solder mask on a package substrate body having a plurality of conductive pads; forming a plurality of first-step openings in the solder mask by exposure and development; forming a plurality of second-step openings in the solder mask by a laser-based or plasma-based drilling process; and removing a solder mask foot from the bottom of each of the first-step openings so as to expose large surface areas of the conductive pads. Hence, the contact area between a conductive element and a corresponding one of the conductive pads is large enough to enhance bonding and electrical connection therebetween.
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