LAMINATION METHOD OF ADHESIVE TAPE AND LEAD FRAME
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United States of America Patent
Stats
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N/A
Issued Date -
Mar 10, 2011
app pub date -
Nov 10, 2009
filing date -
Sep 7, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
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US Family Size
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Non-US Coverage
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Abstract
This disclosure provides a method for laminating an adhesive tape and a lead frame, more specifically to reduce the warpage of a lead frame after heated lamination in which an adhesive tape for manufacturing semiconductor devices is attached to the lead frame, satisfying all the properties required for lamination, and avoiding adhesive residues from adhesive tapes and the leakage of a sealing resin. A method for laminating an adhesive tape and a lead frame comprises laminating an adhesive tape and a lead, wherein the lamination temperature of an adhesive tape surface and that of a lead frame surface are different from each other, for example, wherein the lamination temperature of the lead frame surface is lower than that of the adhesive tape surface by about 1 to about 200° C.
First Claim
Other Claims data not available
Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| KR | B1 | KR101073698 | Sep 07, 2009 |
| MY | A | MY149076 | Nov 04, 2009 |
| TW | A | TW201109406 | Nov 11, 2009 |
| JP | A | JP2011061174 | Nov 24, 2009 |
| CN | A | CN102013402 | Dec 11, 2009 |
International Classification(s)
- 2009 Application Filing Year
- B29C Class
- 2721 Applications Filed
- 1474 Patents Issued To-Date
- 54.18 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 3 Citation Count
- B29C Class
- 7.43 % this patent is cited more than
- 14 Age