Stacking-Type USB Memory Device And Method Of Fabricating The Same
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United States of America Patent
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Issued Date -
Mar 3, 2011
app pub date -
Sep 1, 2010
filing date -
Sep 2, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided is a stacking type universal serial bus (USB) memory device that can reduce the size of the stacking type USB memory device by mounting semiconductor chips in a recess region formed in a substrate and a method of fabricating the same. The stacking type USB memory device includes a substrate that includes a recess region; at least one passive electronic element mounted in the recess region; at least one control semiconductor chip mounted in the recess region; at least one semiconductor memory chip mounted on a first surface of the substrate so as to overlap the at least one passive electronic element, at least one control semiconductor chip, or both of them; and an external wire pattern formed on a second surface of the substrate facing the first surface thereof.
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