Semiconductor Chip Interconnection Structure and Semiconductor Package Formed Using the Same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 3, 2011
app pub date -
Aug 27, 2010
filing date -
Aug 27, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor chip interconnection structure and a semiconductor package formed using the same are provided. The semiconductor chip interconnection structure comprises a chip, a bump assembly and an electrical element. The chip comprises a pad and has a pad aperture from which the pad is exposed. The bump assembly comprises a first bump and a second bump. The first bump is disposed on the pad. The second bump is disposed on the first bump. The outer diameter of the second bump is not less than the outer diameter of the first bump. The electrical element is connected to the bump assembly.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully