MOULDING PROCESSES
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United States of America Patent
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Issued Date -
Mar 3, 2011
app pub date -
May 14, 2009
filing date -
May 14, 2008
priority date (Note) -
Abandoned
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Abstract
Use of a resin system for making a composite material in a liquid moulding process. The resin system comprises an epoxy component and at least one curing agent, and at least 35 wt. % of the epoxy component is one or more naphthalene based epoxy resin. There is also provided a cured composite material, and a method of making the cured composite material in a liquid moulding process which comprises placing fibre reinforcement and the resin system in a mould and curing. The resin system and the methods of making a cured composite material are particularly applicable to liquid moulding processed such as resin trans moulding (RTM), vacuum assisted resin transfer moulding (VARTM), Seeman composite resin infusion moulding (SCRIMP), resin infusion under flexible tooling (RIFT), and liquid resin infusion (LRI).
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