THERMOELECTRIC MODULE

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United States of America Patent

APP PUB NO 20110048486A1
SERIAL NO

12862937

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A thermoelectric module includes: a plurality of thermoelectric elements that is electrically series-connected via a plurality of electrodes; and a pair of substrates on which the plurality of electrodes are formed on facing surfaces of the pair of substrates, the pair of substrates being provided perpendicularly to a heat transfer direction with the plurality of thermoelectric elements being interposed. An electrode of an upper substrate includes a first electrode having a size enough to electrically connect the thermoelectric elements that are spaced apart from each other by a distance corresponding to an area equivalent to an adjacent pair of the thermoelectric elements. An electrode of a lower substrate is provided correspondingly to a maximum placement number of the thermoelectric elements interposed between the substrates, and also has a size enough to electrically connect the adjacent pair of the thermoelectric elements.

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Patent Owner(s)

Patent OwnerAddress
KELK LTDKANAGAWA COUNTY JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Konishi, Akio Hiratsuka-shi, JP 126 662
SENSUI, Osamu Hiratsuka-shi, JP 1 4

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