Patterning of thin film layers
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United States of America Patent
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Jul 2, 2013
Grant Date -
Feb 24, 2011
app pub date -
Nov 25, 2009
filing date -
Aug 19, 2009
priority date (Note) -
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Abstract
Simplified patterning of layers of a thin film is disclosed. In some embodiments, the patterning can include patterning a first conductive layer using a patterned dielectric layer as a mask and patterning a second conductive layer using a patterned passivation layer as another mask. In other embodiments, the patterning can include patterning a first conductive layer using a removable photosensitive layer as a mask, patterning a black mask layer using a removable photo mask, and patterning a second conductive layer using a patterned passivation layer as another mask. In still other embodiments, the patterning can include patterning a first conductive layer using a patterned black mask layer as a mask and patterning a second conductive layer using a patterned passivation layer as another mask. An exemplary device utilizing the thin film so patterned can include a touch sensor panel.
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