METHOD OF PRODUCING AN ELECTRICALLY CONDUCTING VIA IN A SUBSTRATE
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United States of America Patent
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Issued Date -
Feb 24, 2011
app pub date -
Aug 18, 2010
filing date -
Aug 19, 2009
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Abandoned
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Abstract
The present invention relates to a method of producing an electrically conducting via in a substrate and to a substrate produced thereby. In particular, in one embodiment, the present invention relates to a substrate, such as a printed circuit board having one or several metal-free electrically conducting vias.
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