PACKAGE FOR LIGHT EMITTING DIODE, LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE MANUFACTURING METHOD
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 17, 2011
app pub date -
Mar 9, 2009
filing date -
Apr 23, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention relates to a light emitting diode package for mounting a light emitting diode, a light emitting diode device with the light emitting diode package mounting a vertical electrode type light emitting diode thereon and a manufacturing method for manufacturing the light emitting device. has a bonding projection formed to engage resiliently with the molding at both ends thereof.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully