SURFACE TREATMENT METHOD FOR COPPER AND SURFACE TREATMENT METHOD FOR PRINTED WIRING BOARD
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United States of America Patent
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Issued Date -
Feb 17, 2011
app pub date -
Feb 25, 2009
filing date -
Mar 10, 2008
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Abandoned
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Abstract
The present invention provides a surface treatment method for a printed wiring board to form cupric oxide on a surface of an outer layer of copper foil of a laminated board formed by laminating copper foils to base resin layers the cupric oxide being formed to have thickness 0.6 μm to 3.0 μm by performing electrolytic anodizing in an alkaline aqueous solution containing copper oxide ions at a concentration of more than 0.001 mol/l but not more than the saturation point, under the conditions that the electrolytic solution contains sodium hydroxide or potassium hydroxide of 2 mol/l to 6 mol/l and liquid temperature is 50° C. to 90° C.
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