METHOD FOR FORMING A COMPOUND SEMI-CONDUCTOR THIN-FILM
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United States of America Patent
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app pub date -
Oct 1, 2010
filing date -
Apr 2, 2008
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Abstract
A method is provided for fabricating a thin film semiconductor device. The method includes providing a plurality of raw semiconductor materials. The raw semiconductor materials undergo a pre-reacting process to form a homogeneous compound semiconductor target material. The compound semiconductor target material is deposited onto a substrate to form a thin film having a composition substantially the same as a composition of the compound semiconductor target material.
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