Lead-forming die and method of manufacturing semiconductor device utilizing lead-forming die
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United States of America Patent
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Issued Date -
Feb 10, 2011
app pub date -
Jul 27, 2010
filing date -
Aug 6, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided is that a lead-forming die includes an upper die and a lower die disposed so as to oppose the upper die; a supporting unit for semiconductor package, provided on an upper face of the lower die; a moving unit provided on a lower face of the upper die and movable in a direction that the upper die and the lower die oppose each other; a plurality of shafts supported by the moving unit so as to axially move with respect thereto; a presser provided above the supporting unit for semiconductor package, and at a lower end portion of the shaft; and a locking device that stops a movement of the shaft, provided between the upper die and the moving unit.
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