APPARATUS AND METHOD FOR ILLUMINATING THROUGH A CIRCUIT BOARD

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United States of America Patent

APP PUB NO 20110033668A1
SERIAL NO

12628114

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Abstract

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An assembly includes a substrate, a flexible layer, and an adhesive mating the substrate and the flexible layer. The substrate has a first surface and a second surface opposite the first surface. The flexible layer has a first surface and a second surface opposite the first surface. The flexible layer has a thickness such that light passes through the flexible layer without substantial change to a color or an intensity of the light and such that the flexible layer substantially conforms to a shape of the substrate. The adhesive mates the second surface of the substrate and the first surface of the flexible layer and has a viscosity that substantially fills in a texture of at least one of the second surface of the substrate and the first surface of the flexible layer. The adhesive also forms substantially no air gaps.

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Patent Owner(s)

Patent OwnerAddress
METHODE ELECTRONICS INC7401 W WILSON AVENUE CHICAGO IL 60706

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baydoun, Habib I Dearborn Heights, US 1 1
Boelstler, Richard A Lake Orion, US 19 325
Carter, Eluid David Southfield, US 9 94
Hodgman, Daniel W Royal Oak, US 4 88
Williams, Timothy S Holly, US 2 10

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