Substrate processing with reduced warpage and/or controlled strain
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United States of America Patent
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app pub date -
Sep 1, 2010
filing date -
May 12, 2008
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Abandoned
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Abstract
Provided are systems and methods for processing the surface of substrates that scan a laser beam at one or more selected orientation angles. The orientation angle or angles may be selected to reduce substrate warpage. When the substrates are semiconductor wafers having microelectronic devices; the orientation angles may be selected to produce controlled strain and to improve electronic performance of the devices.
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